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tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 1 toshiba led lamp tlrmf1050(t20),tlsf1050(t20), tlof1050(t20),tlyf1050(t20), tlgf1050(t20),tlfgf1050(t20),tlpgf1050(t20) panel circuit indicator ? 5.2 (l) 5.2 (w) 4.0 (h) mm ? tl f1050 (t20) series 3.6 mm transparent lens top type ? ingaa ? p leds ? high luminous intensity and low power consumption. ? colors: red, orange, yellow, green, pure green ? high operating temperature t opr: ? 40 to 100c t stg: ? 40 to 110c ? surface-mount devices ? standard embossed tape packing 8-mm component pitch: t20 (400 pcs/reel) ? reflow-soldering is available ? applications: automotive use, display of interiors, display of air conditioners, car audio, illumination of various switches, etc. color and material unit: mm jedec D jeita D toshiba 4-5au1 weight: 0.085 g (typ.) part number color material tlrmf1050 red tlsf1050 red tlof1050 orange tlyf1050 yellow tlgf1050 green tlfgf1050 green tlpgf1050 pure green ingaa ?p
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 2 absolute maximum ratings (ta = 25c) product name forward current i f (ma) reverse voltage v r (v) power dissipation p d (mw) operating temperature topr( ) storage temperature tstg( ) tlrmf1050 tlsf1050 tlof1050 tlyf1050 tlgf1050 tlfgf1050 tlpgf1050 50 4 120 ?40 to 100 ? 40 to 110 note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: forward current derating electrical characteristics (ta = 25c) forward voltage v f reverse current i r product name min typ. max i f max v r tlrmf1050 1.7 2.0 2.5 tlsf1050 1.7 2.0 2.5 tlof1050 1.7 2.0 2.5 tlyf1050 1.7 2.1 2.5 tlgf1050 1.8 2.2 2.6 tlfgf1050 1.9 2.3 2.6 tlpgf1050 1.9 2.3 2.6 20 50 4 unit v ma a v ambient temperature ta ( c ) i f ? ta 0 80 60 0 100 80 120 40 20 40 20 60 allowable forward current i f (ma)
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 3 optical characteristics-1 (ta = 25c) luminous intensity i v product name min typ max i f corresponding brightness rank sign note 2 tlrmf1050 250 700 2000 ta / ua / va / wa tlsf1050 630 1400 3200 va / wa / xa tlof1050 630 1500 3200 va / wa / xa tlyf1050 630 1000 3200 va / wa / xa tlgf1050 400 900 2000 ua / va / wa tlfgf1050 160 370 800 sa / ta / ua tlpgf1050 100 180 500 20 ra / sa / ta unit mcd ma note 2: the specification on the ab ove table is used for iv classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of each rank be unquestioned.. brightness rank rank sign min max ra 100 200 sa 160 320 ta 250 500 ua 400 800 va 630 1250 wa 1000 2000 xa 1600 3200 unit mcd mcd optical characteristics-2 (ta = 25c) emission spectrum peak emission wavelength p ? dominant wavelength d product name min typ max typ min typ max i f tlrmf1050 ? 636 ? 17 620 626 634 tlsf1050 ? 623 ? 17 607 613 621 tlof1050 ? 612 ? 15 599 605 613 tlyf1050 ? 590 ? 13 581 587 595 tlgf1050 ? 574 ? 11 565 571 576 tlfgf1050 ? 568 ? 11 559 565 571 tlpgf1050 ? 562 ? 11 555 558 564 20 unit nm nm nm ma cautions z this led lamp emits some infrared light in addition to light in the visible spectrum. ensure that this ir light affects no photosensitive device used near the led lamp. z this product is a product developed as a display source of light usage, and the measurement standard matched to the sensitivity of human eyes is applied. therefore, use to functional usages (source of light for the sensor an d the communication) other than the source of light for the display is not intended.
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 4 tlrmf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 ta = 25c 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 forward current i f (ma) forward voltage v f (v) i v ? i f 10 1 10 100 1000 100 300 30 3000 3 30 ta = 25c forward current i f (ma) luminous intensity i v (mcd) relative luminous intensity i v i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 3 5 0.3 0.5 radiation pattern 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c relative luminous intensity wavelength (nm) wavelength characteristic i f ? v f case temperature tc (c)
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 5 tlsf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 wavelength characteristic 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 i f ? v f forward current i f (ma) forward voltage v f (v) i v ? i f 10 1 10 100 1000 100 300 30 3000 3 30 ta = 25c luminous intensity i v (mcd) forward current i f (ma) 0 580 600 620 640 660 680 700 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c relative luminous intensity wavelength (nm) i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 relative luminous intensity i v case temperature tc (c) ta = 25c radiation pattern
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 6 tlof1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 i f ? v f forward current i f (ma) 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 forward voltage v f (v) i v ? i f 10 1 10 100 1000 100 300 30 3000 3 30 ta = 25c luminous intensity i v (mcd) forward current i f (ma) i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 relative luminous intensity i v case temperature tc (c) 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c relative luminous intensity wavelength (nm) wavelength characteristic ta = 25c radiation pattern
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 7 tlyf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 forward current i f (ma) i f ? v f 1 1.6 1.8 2.0 2.2 2.4 10 100 30 3 forward voltage v f (v) i v ? i f 10 1 10 100 1000 100 300 30 3000 3 30 ta = 25c forward current i f (ma) luminous intensity i v (mcd) i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 relative luminous intensity i v case temperature tc (c) ta = 25c radiation pattern 0 540 560 580 600 620 640 660 0.2 0.4 0.6 0.8 1.0 i f = 20 ma ta = 25c wavelength (nm) relative luminous intensity wavelength characteristic
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 8 tlgf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 forward current i f (ma) i f ? v f 1 1.8 2.0 2.2 2.4 2.6 10 100 30 3 forward voltage v f (v) i v ? i f 10 1 10 100 1000 100 300 30 3000 3 30 ta = 25c luminous intensity i v (mcd) forward current i f (ma) i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 relative luminous intensity i v case temperature tc (c) i f = 20 ma ta = 25c 0 0.4 1.0 0.8 540 0.6 0.2 620 600 580 560 wavelength (nm) relative luminous intensity wavelength characteristic ta = 25c radiation pattern
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 9 tlfgf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 i v ? i f 1 1.8 2.0 2.2 2.4 2.6 10 100 30 3 forward current i f (ma) forward voltage v f (v) i f ? v f 1 1 10 100 100 1000 10 30 3 300 3 30 ta = 25c luminous intensity i v (mcd) forward current i f (ma) i v ? tc 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 relative luminous intensity i v case temperature tc (c) i f = 20 ma ta = 25c 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540 relative luminous intensity wavelength (nm) wavelength characteristic ta = 25c radiation pattern
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 10 tlpgf1050 30 30 60 60 0 90 90 0 0.2 0.4 0.6 0.8 1.0 ta = 25c 1 100 30 1.6 2.6 2.4 1.8 2.8 10 3 2.0 50 5 2.2 i f ? v f forward current i f (ma) forward voltage v f (v) i v ? i f 1 1 10 100 100 1000 10 30 3 300 3 30 ta = 25c forward voltage i f (ma) luminous intensity i v (mcd) ta = 25c radiation pattern case temperature tc (c) i v ? tc relative intensity i 0.1 ? 40 1 10 ? 20 0 20 40 60 80 100 0.3 0.5 3 5 wavelength (nm) wavelength characteristic relative intensity i f = 20 ma ta = 25c 0 0.4 1.0 0.8 520 0.6 0.2 600 580 560 540
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 11 packaging these led devices are packed in an aluminum envelope with silica gel an d a moisture indicator to prevent moisture absorption. the optical characteristics of the devi ces may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. this moisture-proof bag may be stored unopened for up to 12 months under the following conditions. temperature: 5 c to 30 c humidity: 90% (max) 2. after the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment of 5c to 30c/70% rh or below. 3. if, upon opening, the moisture indicator card show s humidity of 30% or above (when the indication color changes to pink) or the expiration da te has passed, the devices should be baked while packed in the tape reel. after baking, use the baked devices within 72 hours, but perform baking only once. baking conditions: 60 5c, for 12 to 24 hours. expiration date: 12 months from the sealing date, which is imprinted on the same side as this label. 4. repeated baking may cause the pee ling strength of the tape to change, leading to trouble in mounting. also, be sure to prevent damage to the device from static electricity during the baking process. 5. any breakage in the laminate pack ing material will cause the hermetically of the product to deteriorate. do not toss or drop the packed devices. mounting method soldering ? reflow soldering (example) ? the product is evaluated using above re flow soldering conditions. no addition al test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. ? perform the first reflow soldering in accordance with the above temperature profile and within 168 hours of opening the package. ? second time reflow in case of second reflow soldering should be performed within 168 hours of the first reflow under the above conditions. storage conditions before the se cond reflow soldering: 5 to 30 c, 70% rh max ? do not perform flow soldering and dip soldering. ? make any necessary soldering corrections manually. (only once at each soldering point) soldering iron: less than 25 w temperature: less than 350 c or less time: within 3 s (up to one time per place) 60 to 120 s 10 s max 240 c max 4 c/s max 140 to 160 c 4 c/s max time (s) package surface temperature ( c) temperature profile for pb soldering (example) time (s) package surface temperature ( c) temperature profile for pb-free soldering (example) 150 to 180 c 4 c/s max 5 s max 260 c max 4 c/s max 230 c 60 to 120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30 to 50s max (*) max (*)
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 12 recommended soldering pattern cleaning when cleaning is required after soldering, tosh iba recommends the following cleaning solvents. our dipping tests (carried out under the recommended conditio ns) confirm that these solvents have no effect on semiconductor devices. in selecting the cleaning solvent you will actually use, be su re to take into account the cleaning conditions and usage conditions. cleaning solvent manufacturer asahi clean ak-225aes asahi glass kao clean through 750h kao pine alpha st-100s arakawa chemical precautions when mounting do not apply force to plastic parts of th e led under high-temperature conditions. the led plastic is easily scratched. avoid friction between plastic parts and hard objects or materials. when installing the pcb in a product, ensure that the device does not come into contact with other components. this product doesn't apply mounting that solder flow. please mount on recommended reflow solder mounting condition. tape specifications 1. product number format the type of package used for shipment is denoted by a symbol suffix after the product number. the method of classification is as below. (this method, howeve r, does not apply to products whose electrical characteristics differ from standard toshiba specifications.) (1) tape type: t20 (8-mm pitch) (2) example tape type 2. handling precautions tape material protected against static electr icity. however, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) in process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. (b) for transport and temporary st orage of devices, use containers(boxes, jigs, and bags) that are made of anti-static material s or of materials that dissipate electrostatic electricity. 2.45 1.3 2.7 unit: mm 2.45 tlrmf1050 (t20) toshiba product no.
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 13 3. tape dimensions (unit: mm) symbol dimension toleranc e symbol dimension tolerance d 1.5 +0.1/?0 p 2 2.0 0.05 e 1.75 0.1 w 12.0 0.2 p 0 4.0 0.1 p 8.0 0.1 t 0.4 0.05 a 0 5.5 0.1 f 5.5 0.05 b 0 5.5 0.1 d 1 1.6 0.1 k 0 4.4 0.1 a 0 p d 1 f e w polarity t k 0 b 0 d p 2 p 0
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 14 4. reel dimensions unit: mm 5. leader and trailer section of tape 13 0.3 180 +0 ?4 60 13 15.4 1.0 2 0.5 44 40mm or more 40mm or more leading part 190 mm (min)
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 15 6. packing form (1) packing quantity reel 400 pcs carton 2,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 7. label format (1) example: tlrmf1050 (t20) p/n: toshiba type tlrmf1050 addc (t20) q?ty 400 pcs lot number key code for tsb 32c 400 (rank symbol) use under 5-30degc/70%rh within 168h sealed [[g]]/rohs compatible diffused in ***** *y380xxxxxxxxxxxxxxxxxx* assembled in ***** (2) label location *the lot number includes the following information. example: 270 8 d 3 b ?packaged april 22, 2008? a b c d e a: domestic id b: last digit of the year (ce): ?0? (y2000), ?1? (y2001), ?2? (y2002) to ?9? (y2009) repeated for each decade c: month: ?a? (jan), ?b? (feb), ?c? (mar) to ?l? (dec) d: decade of the month: ?1? (first), ?2? (middle), ?3? (last) e: day in d above: ?a? (1st), ?b? (2nd), ?c? (3rd) to ?j? (9th), ?k? (10th) ?l? denotes the 31st of the month ?i? is not used to denote a day in this date system tape reel direction label position label position ? reel ? carton ? the aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.
tl(rmf,sf,of,yf,gf,fgf,pgf)1050(t20) 2008-08-26 16 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale fo r product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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